Modelling for Heat Transfer Enhancement Using Nano Fluids for Cooling of Electronic Component: A Review

Abstract

Traditional cooling systems (Air cooling techniques) are not sufficient to remove these heat fluxes, so for many applications, this traditional technique will have to be replaced or increased by some other cooling techniques. The mixture of heat transfer fluid and solid particles together is termed as 'Nano fluid'. Nano fluids are good alternatives for electronic cooling applications. If nanoparticles size is not selected properly then they, settles very fast which causes clogging and damage to pump and flow equipment’s. The purpose of this paper is to investigate the literature study, which are been, carried out for potential of using Nano fluids for enhancing heat transfer in the cooling of electronic components. The findings of this study will provide valuable insights for the design and optimization of cooling systems for electronic components, and the use of Nano fluids holds significant promise for achieving better cooling performance and the studies that are linked to these will be considered