Status of research on residual stress in micro-nano-scale thin-film/substrate materials

Abstract

Residual stress is the main reason for functional failure that can lead to significant changes in sample shape and even delamination, buckling, and cracking. These phenomena not only destroy the structural integrity of devices but also directly affect optical, electrical, mechanical, and physical properties. In this work, the mechanism model and test method of residual stress in a micro-nano-scale thin-film/substrate system was summarized to explore the relationship between characteristic parameters and residual stress. Then, the effects of deposition conditions, thickness, and process parameters (sputtering power, working pressure, substrate temperature, and annealing) on the stress distribution of monolayer films and that of the modulation period and buffer layer on the stress distribution of multilayer films were discussed. Finally, the future of the research on residual stress in the thin-film/substrate system was outlined. Research should be conducted on mechanism models, stress distribution, and functional material exploration.